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CEOCFO CEOCFO Monthly Analyst |
Introduction of new products and
expansion of its customer base has CyberOptics well positioned for the recovery of the
electronic assembly and semiconductor capital equipment markets Technology Company Profile: CyberOptics’
electronic assembly (EAS) sensors are incorporated into the robotic pick-and-place
equipment used in the assembly process for printed circuit boards. After solder paste has
been inspected and measured, small surface mount components and resistors are placed on
the solder pads by robotic component placement equipment. CyberOptics' family of
LaserAlign sensors is incorporated into the placement heads of this equipment to ensure
accurate component placement at high production speeds. An intelligent sensor composed of
a laser, optics, detectors, a microprocessor and software, LaserAlign quickly and
accurately aligns each component while being transported by the pick-and-place arm for
surface mount assembly. By facilitating component placements at higher speeds than
conventional centering and vision systems, LaserAlign lowers the cost per component
placement of robotic pick-and-place equipment. LaserAlign is currently used in the
component placement equipment of the industry leaders serving the high-speed and mid-range
SMT assembly market segments. Depending on equipment speeds and designs, this robotic
equipment will utilize between one and sixteen LaserAlign sensors per machine. . End-User Inspection Systems CyberOptics',
which pioneered the development of in-line, three-dimensional solder paste inspection, has
the world’s largest installed base of these systems, which inspect solder paste
quality before components are placed on the circuit board.It is estimated that upwards of
60% of all board defects are related to problems with solder paste quality.
CyberOptics’ SE 300 provides full-board or 100% inspection capabilities. In addition
to its greater operating speed than prior models, the SE 300 has enhanced optical
capabilities, enabling it to inspect solder pads for the smallest components, including
micro-BGAs. It is believed that the technical
capabilities of the SE 300 surpass those of any other solder paste inspection system
currently on the market. Over the past two years, CyberOptics has introduced additional automated optical inspection (AOI) systems based upon its proprietary Statistical Appearance Modeling TM technology. Electronics manufacturers have long been interested in AOI as a way to inspect printed circuit boards after all of the components have been placed and for checking joint quality after the soldering process. Conventional AOI technology has been plagued by serious shortcomings, including high rates of inaccurate readings or false calls and training difficulties.CyberOptics KS family of post-placement and post-reflow inspection systems are noted for their low rates of false calls and user friendliness. In January 2002, CyberOptics introduced two new high-resolution, full-color AOI systems. The KS 75 was developed for solder joint inspection after the reflow or component soldering process, which constitutes the largest segment of the AOI market. The KS 200 is designed for post-placement inspection of the smallest (.02 X 01 inch) components, which are no larger than a speck of pepper. With the introduction of these new systems, CyberOptics now offers a virtually complete range of solder paste, post-placement and post-reflow inspection solutions. CyberOptics believes that its full-service inspection capabilities will enable it to further increase its penetration of the growing inspection market. Going forward, the company believes inspection systems will be one of its primary growth drivers. Interview Highlights: To
receive a copy of this highly informative interview, left click here: Contact & Ordering |
